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Device name: High-Speed Mounter
Device Description: Features of equipment

The mounter is suitable for the high-speed mounting of small components. The idea of a single module as a module production capacity can be composed of flexible production line.

13,200CPH:Chip (laser identification / production efficiency)

Laser titles paste×1 (4 Tips)

0603(British 0201)Chip~20mm Square components、or 26.5×11mm

0402(British 01005)For the chip factory option

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